Long throw sputtering
Web3 de jun. de 1998 · Two-step planarized Al-Cu PVD process using long throw sputtering technology. Abstract: In this paper, comprehensive studies on planarized Al alloy … WebCopper Wires for High Speed Logic LSI Prepared by Low Pressure Long Throw Sputtering Method Tatsuyuki Saito, Takashi Hashimoto, Naofumi Ohashi, Tsuyoshi Fujiwara and Hizuru Yamaguchi Device Development Center, Hitachi Ltd., Ome 198-8512, Japan Copper sputtering method for fabrication of high performance logic LSI was studied.
Long throw sputtering
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Web24 de fev. de 2024 · Long throw projectors are meant to sit far from a projection surface while short throw projectors are meant to sit closer. Because short throw projectors are … Web1 de mai. de 2000 · Abstract We present an optimization of long-throw sputter-deposited Cr/CoCrPt films, specifically for (lifted-off) hard bias applications in an AMR/GMR head. Deposition was carried out in the...
Web1 de jul. de 2002 · Copper sputtering method for fabrication of high performance logic LSI was studied. Extension of target to substrate distance is effective to improve step coverage of sputtered film combined with reduced operation pressure. Step coverage of low pressure long throw sputtering method also strongly depends upon the feature size of trenches … Web1 de mar. de 2001 · The 430 mm process was compared to the earlier long throw generation using 245 mm source-to-substrate distance in both contact and via structures. Electrical results are given showing that using ...
WebIn standard sputtering configurations, there are two primary reasons for a wide angular distribution of incident flux: first, the distance of a small target to substrate, and secondly, the scattering of the flux by the neutral working gas as the … http://kjmm.org/m/journal/view.php?number=536
Web3 de mar. de 2024 · Longer throw implies more collisions and a degraded collimation, so the pressure needs to be very low to counterbalance that effect. An ideal way to address …
Web14 de set. de 2012 · Request PDF Side Magnet Designs and Magnetic Field Effects on Effective Gap Filling of Longthrow Sputtering PVD for 3DIC Application This study used Finite Volume Method to simulate ... samsung kies download androidWeb1 de jul. de 2010 · Additionally, long-throw rf sputtering is par- ticularly useful for low-temperature processes as the substrate is placed away from the target, and there- fore … samsung kies per windows 10WebCu metallization technology using sputtered Cu wiring and W-plug is developed. Submicron trenches for wiring with up to 0.4 /spl mu/m width are filled with Cu by a low-pressure long-throw sputtering method followed by a reflow process. Blanket-W CVD with a sputtered W barrier is used for via filling. Using these technologies, multilevel Cu interconnect test … samsung kies windows 10 exeWeb15 de mai. de 2015 · We report on the fabrication of amorphous zinc tin oxide (ZTO) thin films by long-throw magnetron sputtering on glass substrate. This method is especially … samsung kings cross opening hoursWeb3 de jun. de 1998 · Two-step planarized Al-Cu PVD process using long throw sputtering technology Abstract: In this paper, comprehensive studies on planarized Al alloy interconnect and contact plug technology using long-throw-sputtering (LTS) and two-step cold/hot Al flow technologies are presented. samsung kies tablet software updateWeb1 de mar. de 2001 · The extended long throw chamber called Ultra is an evolution of the earlier chamber with target to substrate spacing increased to 430 mm. Modelling and … samsung kies for pc windows 10WebM. J. Chuang and A. K. Chu,0000,On the Structure and Surface Chemical Composition of Indium-Tin Oxide Prepared by Long-throw Magnetron Sputtering,Proc. OPT ... 2006/00/00. A. K. Chu and M. T. Lin,0000,Post annealing of ITO thin films prepared by magnetron sputtering without oxygen partial pressure on silicon substrates, Proc. … samsung kies windows 7 32 bit free download